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Gap fillers
   
 

Thermally conductive gaps fillers are used to fill air voids between high temperature components and heat sinks, metal enclosures or chassis.

Their flexible and elastic nature allows them to blanket highly uneven surfaces. Heat is conducted away from separate components or entire PCBs into metal covers, frames or spreader plates. A full range of products is available for optimum solutions to different application needs.

Therm-a-gap 570 & 580
Ultra-soft silicone elastomer filled with ceramic particles.
Available in 2 versions: G570/580 (fiberglass carrier) and A570/580 (aluminum foil carrier).
Therm-a-gap T630
Ideal for applications where typical gap filling pads cause too much stress on component solder joints and leads.
Therm-a-gap T635 & 636
Highly conformable, one-component, pre-cured silicone gels that can be dispensed to fill large and uneven gaps.
Therm-a-gap G974
Higly thermally conductive, this material conforms to surface irregularities under moderate application pressures to fill air gaps and enhance heat transfer.
Therm-a-gap 174, 274 & 574
Flexible and elastic product range to fill air gaps between hot components and heat sinks or metal chassis.
   


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