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T725, 443, 310 & 710
T725 is used for high power microprocessors (>50 watt dissipation), DC/DC converters, IGBTs and other power modules.
T443 and T710 are usually used for microprocessors and heat spreaders attached to heat sinks with spring clips.
Inherently tacky surface of T310 eliminates need for mounting PSA and allows pad to be repositioned prior to final heat sink assembly.
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T766
Consists of a tacky, electrically non-conductive phase change film on one side of a conformable metal foil carrier, allowing a clean break during disassembly or rework.
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T454 & 506
Unsupported free films that can yield very thin bond lines between a hot component and a heat sink or heat plate.
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T557 & T558: Multiphases
T557 provides improved thermal stability over conventional phase change pads.
T558 recommended for applications where rework and ease of disassembly are important.
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Phase changed material range combines the consistency and ease of use of elastomeric pads with the low thermal impedance of thermal grease.