Test Reports

The user, through its own analysis and testing, is solely responsible for making the final selection of the system and components and assuring that all performance, endurance, maintenance, safety and warning requirements of the application are met. The user must analyze all aspects of the application, follow applicable industry standards, and follow the information concerning the product in the current product catalog and in any other materials provided from Parker or its subsidiaries or authorized distributors.

Test Report Format Size
EMI Shielded Corrosion Resistant Gaskets
Electromagnetic performance tests on CHO-SEAL 6502/6503 (nickel-plated, aluminum filled) and CHO-SEAL 1298 (silver-plated, aluminum filled) elastomers, after exposure to extreme environmental conditions, including salt-fog exposure.
1298
1.0 MB
An Evaluation of the Transfer Impedance of CHO-SEAL® Shielded Elastomers. PER CHO-TP10
6502/6503, 1298
714 KB
An Evaluation of the Shielding Effectiveness of CHO-SEAL® EMI Shielding Elastomers. PER CHO-TP09
6502/6503, 1298
743 KB
EMI Shielding
CHO-SEAL 1298 Elastomer with CHO-SHIELD 2001 Coating 336 KB
937 KB
CHO-SHIELD 2000- Fluid Resistance and Moisture Absorption 110 KB
322 KB
434 KB
CHO-FORM 5541 Reliability Test Report 433 KB
CHOFORM 5550 and 5541 Corrosion Testing 30 KB
CHOFORM 5550 and 5541 Electrical Properties 37 KB
CHOFORM 5550 and 5541 Compression/Deflection 31 KB
1.1 MB
248 KB
1.1 MB
1.0 MB
An Evaluation of the Transfer Impedance of CHO-SEAL®® Shielded Elastomers. PER CHO-TP10
714 KB
An Evaluation of the Shielding Effectiveness of CHO-SEAL®® EMI Shielding Elastomers. PER CHO-TP09 743 KB
1.4 MB
PREMIER Conductive Plastic - Shielding Effectiveness - Per ASTM 4935 1.2 MB
PREMIER Conductive Plastic - Shielding Effectiveness - Per FAR Field Measurement 552 KB
PREMIER Conductive Plastic- UL 94 322 KB
PREMIER Conductive Plastic - NEBS Compliance 86 KB
PREMIER - Conductive Plastic - Stability Testing 185 KB
PREMIER - Conductive Plastic - Faceplate Shielding Effectiveness 305 KB
PREMIER - Conductive Plastic - RoHS 45 KB
Thermal Interface Materials
THERMFLOW® T557 Tested with Voids 127 KB
THERMATTACH T412 Thermal Tapes 97 KB
THERMATTACH 404 and 405 Thermal Tapes 1.1 MB
Shock and Vibration Testing for THERMATTACH T411 26 KB
THERMATTACH T414, T413 Thermal Tapes 500KB
THERMATTACH T411 Thermal Tapes 37 KB
Quality Control Test Specification for THERMATTACH Tapes 28 KB
THERM-A-GAP 569 Reliability Test Report 48 KB
THERM-AGAP 579 Reliability Test Report 48 KB
Shock and Vibration Testing for T-WING Heat Spreaders 16 KB
Therm. Performance vs. Contact Pressure for THERMFLOW T725 40 KB
THERMFLOW T725 Application Guidelines 79 KB
THERMFLOW T725 Typical Application Test Results 30 KB
THERMFLOW T725 Reliability Test Results 50 KB
THERMFLOW T766 Thermal Impedance Test Report-(Effects of Pressure and Temperature) 65 KB
THERMFLOW T766 Thermal Impedance Test Report 590KB
THERMFLOW T766 Removal Force Test Report 200 KB
THERMFLOW T766 Reliability Test Report 200 KB
THERMFLOW T777 Reliability Test Report 218 KB
THERM-A-GAP GEL 30 Reliability Report 760 KB
THERM-A-GAP GEL 8010 Reliability Report 178 KB
THERMATTACH T418 Reliability Report 81 KB
Semiconductor Materials
THERMATTACH T424+T427 BGA Assembly Tapes 1.0 MB

 

 

 

 

NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential use are beyond our control, all recommendations or suggestions are presented without guarantee or responsibility on our part and users should make their own tests to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise, except that this product shall be of standard quality, and except to the extent otherwise stated Chomerics’ invoice, quotation, or order acknowledgement. We disclaim any and liability incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing or future patents covering any product or material or its use.