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LEADERSHIP FUELED BY INNOVATION IN ELECTRONICS PACKAGING
Chomerics can be considered the world's most fertile source of unique materials for EMI shielding and thermal management, and efficient manufacturing methods to produce them.

Our significant contributions to electronic packaging include:

• Metal-filled conductive elastomer EMI gaskets
• Silver-plated-copper and silver-plated aluminum filler powders
• Ceramic-filled thermally conductive silicone insulators
• Membrane keyboards based on screen-printable conductive inks
• Injection molding processes for metal-filled elastomers
• Extrusion processes for metal-filled elastomers
• Anisotropic conductive elastomer interconnectors
• Chemically cross-linked heat-shrinkable molded plastics
• Low-profile "peel and stick" heat spreaders
• Quick-curing robotically dispensed EMI gaskets
• Metal-filled organic shielding paints
• Thermally conductive double-sided adhesive tapes
• EMI/environmental missile canister seals
• Sublimation printed keycaps
• Solderable conductive inks