EMI
Shielding Optimized Using FEA
FEA (finite element analysis) is a dominant component of CAE (computer-aided
engineering) technologies, and has been widely used to solve various
complex design problems. As a premier manufacturer of EMI (electromagnetic
interference) shielding, Chomerics, a member of Parker Hannifin's
Seal Group, has established a recognized leadership in this technology.
FEA offers customers dramatic time- and cost-saving benefits.
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To help
with EMI shielding problems, experienced engineers at Chomerics
typically start with CAD (computer-aided design) drawings
of a various conceptual designs. These designs are analyzed
using a sophisticated, non-linear FEA software. The FEA is
capable of modeling Chomerics' conductive elastomer materials
with large deformation and complex contact problems. From
these analyses, critical design information can be obtained,
including:
- seal
deformation (deformed shape)
- volume/void
ratios, gland-fill %
- load-deflection
- stress
distribution
- sealing
area and contact pressure
- friction
effect
- thermal
effect
- structure
stability
- material
selection
- seal
lif
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This allows
engineers to make quick, informative comparisons, changes, and
design optimizations. As the result, a best solution to the
customer problem can be reached rapidly and efficiently.
..... This integrated design process
has significantly differentiated Chomerics from its competitors,
and has produced many customer-awarded EMI shielding seal designs.
One example is a low closure force, molded seal, which was designed
by subtly combining two featured structures - a cross section
that would bend under deflection and a longitudinal waveform
continuation of the cross section. (See CAD and FEA figures.)
This complex seal structure, which must meet all customer specifications
in closure force, sealing position, and contact area, could
only be effectively optimized through FEA. This design has become
a standard molded seal design that Chomerics uses for EMI shielding
of wireless handsets, PCI cards, and many other miniature devices.
..... The seal design described
above is not the only area where Chomerics has used FEA successfully.
Great progress, in fact, has been made in FEA-aided characterization
of electronic packaging materials, and determination of molded-seal
shrinkage.
..... Besides FEA, Chomerics uses
CAE technology in areas such as conductive elastomer molding
and extrusion process simulations. In the hands of mold and
extrusion die designers these powerful tools continually provide
productivity improvements, higher product quality and better
customer service. |
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