T-Wing® and C-Wing™ Heat Spreaders
T-Wing® and
C-Wing™ heat spreaders provide a low-cost, effective means of cooling
IC devices in restricted spaces where conventional heat sinks aren't
appropriate. They typically provide junction temperature reduction
of 20° C when applied on microprocessors and cache chips in
laptop PCs and other high density, handheld electronics, and on
disk drives. They're easily added by peel and stick application.
T-Wing heat spreaders use copper as a thermal conductor.
They conform to non-flat surfaces for optimal thermal and mechanical
performance. C-Wing heat spreaders are ceramic, electrically
non-conductive cooling solutions where localized sensitivity to
EMI (electromagnetic interference) may be an issue.
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Data Sheet (.pdf)
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Typical
Applications:
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