THERMFLOW® T725
phase-change thermal interface material combines the consistency
and ease of use of elastomeric pads with the low thermal impedance
of thermal grease. This low thermal resistance path maximizes heat
sink performance and improves the reliability of microprocessors,
memory modules, DC/DC converters and power modules. For high power
microprocessors (>50 watt dissipation), DC/DC converters, IGBTs
and other power modules - Recommended for pressure range of 5 to
50 psi.
