THERMFLOW®
T557 & T558 MULTIPHASE™ Thermal Interface Material
THERMFLOW™ T557 MULTIPHASE thermal interface pads are
phase-change materials specially formulated for use in high performance
devices requiring minimum thermal resistance for maximum thermal
performance and component reliability. T557 provides the high performance
of typical phase change materials with the added benefit of improved
thermal stability over conventional phase change pads. T557 is a
0.005 inch (0.13mm) thick, inherently adhesive film that softens
at device operating temperatures resulting in “grease-like”
performance.
THERMFLOW
T558 is recommended for applications where rework and ease of
disassembly are important. This new material provides the high performance
properties typical of free-film phase change materials with the
added benefit of easy removal. T558 is the same phase material as
T557 which has been coated on one side of a conformal metal foil
carrier. It is easily attached onto a heat sink or heat spreader,
leaving the metal foil surface exposed. This foil eliminates the
need of a protective liner, which simplifies the final assembly
process and minimizes shipping concerns and contamination issues.
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Typical
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