THERMFLOW®
T710 Phase-Change Material
THERMFLOW®
T710 phase-change thermal interface material combines the consistency
and ease of use of elastomeric pads with the low thermal impedance
of thermal grease. This low thermal resistance path maximizes heat
sink performance and improves the reliability of microprocessors,
memory modules, DC/DC converters and power modules. For microprocessors
and power ICs, which are typically attached to heat, sinks with
spring clips - Recommended for pressure range of 5 to 50 psi. PSA
versions allow “peel and stick” installation.
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