Literature Order Sample

Attachment Tapes

Thermal Tapes THERMATTACH® tapes are formulated with acrylic or silicone based pressure sensitive adhesive (PSA) loaded with thermally conductive fillers. They are designed to securely bond heat sinks to power dissipating components without an additional clamping mechanism.

  • Acrylic based adhesives for metal or ceramic packages
  • Silicone based adhesive for bonding plastic packages to heat sinks
  • Ionically pure formulations for use inside component packages and on printed circuit boards
  • Limited gap filling properties require reasonable surface flatness
  • High shear strength at elevated temperatures


Thermal tapes are used primarily for their mechanical adhesive properties, and to a lesser extent for their thermal properties. The thermal conductivity of these tapes is moderate and their thermal performance in an application is dependent on the contact area that can be achieved between the bonding surfaces.


NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential use are beyond our control, all recommendations or suggestions are presented without guarantee or responsibility on our part and users should make their own tests to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise, except that this product shall be of standard quality, and except to the extent otherwise stated Chomerics’ invoice, quotation, or order acknowledgement. We disclaim any and liability incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing or future patents covering any product or material or its use.