Thermally Conductive Gap Filler Pads

Typical Properties TS15 Test Method
Color Teal / Blue Visual
Carrier Fiberglass reinforced
dielectric layer with PSA
Standard Thicknesses*, inch (mm) 0.040 - 0.200
(1.0 – 5.0)
Specific Gravity 2.2 ASTM D792
Hardness, Shore A 50 ASTM D2240
Percent Deflection @ Various Pressures
(0.125 in thick sample)
@ 5 psi (34 kPa)
@ 10 psi (69 kPa)
@ 25 psi (172 kPa)
@ 50 psi (345 kPa)
% Deflected
(0.125in “G” Type, 0.50 in dia.
sample, 0.025 in/min rate)
Tensile Strength, psi 250 ASTM D412
Tear Strength, lb/in 40 ASTM D624
Elongation, % 20 ASTM D412
Thermal Impedance, °C-in2/W (°C-cm2/W) @ 10 psi (69 kPa) @ 0.04” (1mm) thickness 1.5 (9.7) ASTM D5470
Heat Capacity, J/g-K 1 ASTM E1269
Coefficient of Thermal Expansion, ppm/K 250 ASTM E831
Dielectric Strength, VAC/mil (KVAC/mm) 200 (8) ASTM D149
Volume Resistivity, ohm-cm 1014 ASTM D257
Dielectric Constant @1,000 kHz 6.5 ASTM D150
Dissipation Factor @ 1,000 kHz 0.013 Chomerics Test
Flammability Rating
(See UL File E140244 for Details)
Pending UL 94
RoHS Compliant Yes Chomerics Certification
Outgassing, % TML (% CVCM) Pending ASTM E595
Shelf Life, months from date of shipment 18 Chomerics

*Thickness tolerance, inch (mm) ±10% nominal thickness @ 0.100in. (2.5mm) or less;
± 0.010in.(0.25mm) @ nominal thickness greater than 0.100in. (2.5mm). Custom thicknesses may be available upon request.





NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential use are beyond our control, all recommendations or suggestions are presented without guarantee or responsibility on our part and users should make their own tests to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise, except that this product shall be of standard quality, and except to the extent otherwise stated Chomerics’ invoice, quotation, or order acknowledgement. We disclaim any and liability incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing or future patents covering any product or material or its use.