gap filler pads

THERM-A-GAP™ gap fillers are a family of low modulus (soft), thermally conductive silicone and non-silicone elastomers for applications where heat must be conducted over a large and variant gap between a semiconductor component and a heat dissipating surface.

  • Soft binder provides low modulus for conformability at low pressures
  • Low modulus allows materials to make up for large tolerance stack ups
  • Low pressure applications

Gap fillers are used to bridge large gaps between hot components and a cold surface. The gaps are not only large, but their tolerances can be ±20 % or greater. This means that the gap filler must have sufficient compliance to fill such spaces without stressing components beyond their safe limits. Non-silicone gap fillers are available for silicone sensitive applications.

Gap fillers are supplied in pad-form over a wide range of thickness, 0.25 to 5mm, and can be molded into complex shapes. THERM-A-GAP GELs are also supplied as pre-cured, single component compounds that can be dispensed over the heat generating component.


NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential use are beyond our control, all recommendations or suggestions are presented without guarantee or responsibility on our part and users should make their own tests to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise, except that this product shall be of standard quality, and except to the extent otherwise stated Chomerics’ invoice, quotation, or order acknowledgement. We disclaim any and liability incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing or future patents covering any product or material or its use.