THERM-A-GAP™ T630, T630G, T635, & T636 Gap Fillers - are Chomerics’ latest development in thermally conductive gap fillers. These unique materials are ideal for applications where typical gap filling pads cause too much stress on component solder joints and leads, resulting in damage to the printed circuit board. These gap fillers are highly conformable, one component pre-cured silicone that can be dispensed to fill large and uneven gaps in electronics assemblies. The viscoelastic paste is a form stable, fully cured silicone material that takes little to no compressive force to deform during assembly. The "G" versions contain 0.010” glass beads, used for a compression stop for applications requiring electrical isolation. All products have low extractable silicone levels and pass the Bellcore silicone extractable specification for the telecom industry.

Download T630/T630G Data Sheet (.pdf)
Download T635/T636 Data Sheet (.pdf)
Download T630/T630G Application Guide (.pdf)
Download T635/T636 Application Guide (.pdf)
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Typical Applications

• Power Conversion
  
• Information Technology

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