THERM-A-GAP™
174, 274, and 574
THERM-A-GAP
thermal interface materials fill air gaps between hot components
and heat sinks or metal chassis. Their flexible, elastic nature
allows them to blanket highly uneven surfaces. Heat is conducted
away from separate components or entire PCBs into metal covers,
frames or spreader plates.
THERM-A-GAP A174 materials are suited for high volume, low
cost applications, such as in automotive electronics, laptop PCs,etc.
THERM-A-GAP A274 materials can be molded to meet exact dimensions
required for optimum electronics packaging.
THERM-A-GAP A574 materials are ideal for heat flux typical of
microprocessors, video chips and power semiconductors.
"Clean-Break"
option available for 174 and 547 THERM-A-GAP materials. See product
data sheet for G174 and G574.
Download
THERM-A-GAP Brochure (TB #70) (.pdf)
Download
G174 Data Sheet (.pdf)
Download
G574 Data Sheet (.pdf)
Download
G574 MSDS (.pdf)
Download
A174 MSDS (.pdf)
Download
A274 MSDS (.pdf)
Download
A574 MSDS (.pdf)
Request
a Sample
Typical
Applications
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