THERM-A-FORM™
form-in-place materials are used for heat transfer applications
in electronic component cooling. These flexible elastomer compounds
minimize stress on components. They are available in a range of
kit sizes for both manual and pneumatic dispensing.
S THERM-A-FORM T642 silicone encapsulant is ideal for underfilling
or other component-level heat transfer applications.
THERM-A-FORM T644/T644G compound is a very low modulus material
for transferring heat from fragile electronic parts.
THERM-A-FORM T646 compound transfers heat from hot components
to heat sinks, PC boards, metal enclosures and chassis. It combines
high thermal conductivity and low cost into an easily applied solution.
