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| Tape
Bonds Heat Sinks to Plastic BGA Packages |
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.....A
contract manufacturer was experiencing reliability problems
with a thermally conductive tape used for bonding heat sinks
onto hot-running graphics driver ICs. The tape provided inconsistent
adhesion to the plastic IC packages. Silicone contamination
on the plastic package surfaces reduced the bond strength of
the acrylic-based thermal tape.
The silicone came from a release agent used in the package molding
process. |
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| To
provide a stronger bond to plastic IC packages, Chomerics formulated
new THERMATTACH T410 double-sided pressure sensitive adhesive
(PSA) tape. The T410 thermal tape features a silicone-based
PSA on one side of a 0.002 inch (0.05 mm) aluminum foil layer.
The silicone adhesive bonds more securely than acrylic-based
tapes to plastic packages |
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.....The
tape's other side -- a thermally loaded, high bond strength,
acrylic PSA -- bonds securely to metal heat sinks. By optimizing
each adhesive side for its intended substrate, Chomerics has
produced a strong, reliable, compliant and highly thermally
conductive interface between the heat sink and the plastic component.
..... Applications for THERMATTACH
T410 tape include bonding heat sinks to molded plastic BGA packages
that typically
For more information. see Chomerics'
THERMATTACH T410 Tape
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