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Phase
Change Thermal Interface Material
for DC/DC Converter Application
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.....While
assembling DC/DC converters and heat sinks onto a printed circuit
board (PCB), a telecommunications equipment manufacturer encountered
two problems with graphite-based thermal interface pads.
..... The first problem concerned
ease of assembly. The pressure sensitive adhesive (PSA) on the
graphite pad was so aggressive that the operator would often
damage a misaligned pad while removing it for repositioning.
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.....
The second problem with the graphite-based pads was their electrical
conductivity. If fragments of the pad broke off along the exposed
edges, they might fall across PCB traces, leading to possible
electrical shorts and system failures.
.....By
using Chomerics' THERMFLOW T310 phase change interface material,
the manufacturer solved these problems without reducing thermal
or mechanical performance.
T310 material is formulated with an integral PSA, giving it
an inherent surface tackiness. The pads hold in place during
assembly, and are easily realigned before final mounting of
the heat sink. The material is not electrically conductive,
eliminating the risk of potential short circuits.
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.....At
room temperature, THERMFLOW T310 material is an easily handled
solid. When it reaches operating temperatures, the material
softens and conforms to mating surfaces, much like thermal
grease. In filling the air gaps created by mounting surface
imperfections and non-flat conditions, typical of DC/DC converters
and their heat sinks, T310 pads outperform non-flowing elastomeric
or graphite-based pads. Optimal performance is at contact
pressures of 50 to 300 psi (0.3 to 2.1 MPa), typical of DC/DC
converters mechanically fastened to a heat sink or system
chassis.
For more information, see Chomerics'
THERMFLOW T310 Phase Change Material
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