......A
notebook PC manufacturer needed a thermally conductive interface
material for a new model's cooling system. The notebook's microprocessor
was located under the keyboard assembly. Heat from the processor
was collected by an aluminum spreader and carried to the side
of the notebook via a heat pipe. A fan shunted the heat out
of the enclosure.
.... The interface material was
needed to conduct heat from the processor to the spreader. It
must fill an air gap that varied from 1.0 to 1.5 mm (40 to 50
mil) due to flexing of the keyboard, where the spreader was
mounted. The material also had to conform to uneven surfaces
on the processor and the aluminum spreader to maximize thermal
flow. Finally, the manufacturer wanted a material that installed
easily and could be removed during maintenance.
no PC manufacturer needed a thermally conductive interface material
for
..To
meet these requirements, Chomerics provided die-cut pads of
its new THERM-A-GAP ® F574 thermally conductive gap filler.
This is the softest of Chomerics' family of gap filler materials,
deflecting up to 50% under compression as low as 50 psi. Its
thermal conductivity, 1.4 Watts/m-K, makes T574 material one
of the highest performers in the THERM-A-GAP line.
.
The ceramic-filled silicone pads are reinforced with fiberglass
mesh, providing easier handling and installation. T574 material
has an inherently tacky surface and does not require any mounting
adhesive. This property allows easy removal from parts during
servicing.
.... For
more information, see Chomerics' THERM-A-GAP T574 Thermal
Gap Filler technical bulletin.
