Conductive elastomer overmolded solutions can be designed with plastic or metal substrates. Over the years, elastomer overmolds on plastic have been used as conductive spacer board shields on handheld electronic devices, charger stations for medical devices and flexible conductive switches. Selection of a high temperature plastic and part design, gasket design including finite element analysis and final packaging for easy integration into a customer assembly are all features of a plastic based conductive elastomer overmold.
The same conductive elastomer overmolds can be supplied on a variety of metal substrates. These can include stamped metal cans, metal faceplates or covers, knitted wire mesh shrouds and plated or chromate conversion coated machined aluminum housings. The gasket overmold can include formed shapes and profiles and even dual bead conductive/non-conductive perimeter seals.
Conductive elastomer overmolds on metal have been specified on a wide variety of military(Vulcanized Covers & Vulcon tm), medical and commercial applications. Chomerics in-house machined metal substrate capabilities are often instrumental in supporting both customer prototyping and production ramp-up efforts.
NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential use are beyond our control, all recommendations or suggestions are presented without guarantee or responsibility on our part and users should make their own tests to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise, except that this product shall be of standard quality, and except to the extent otherwise stated Chomerics’ invoice, quotation, or order acknowledgement. We disclaim any and liability incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing or future patents covering any product or material or its use.