Parker Chomerics family of engineered laminates for EMI shielding and grounding consist of foil and film dielectrics adhesively joined for a custom laminate solution. The electrically conductive portion includes: aluminum, copper, or tin-plated copper foil; nickel-plated copper, polyester taffeta; nickel-plated silver, nylon taffeta; and nickel-plated silver, nylon rip-stop. Available dielectrics include: mylar; PVC; polypropylene (Formex™); and Kapton®. Adhesive offerings include: acrylic; electrically conductive acrylic; fire retardant conductive acrylic, and silicone.
NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential use are beyond our control, all recommendations or suggestions are presented without guarantee or responsibility on our part and users should make their own tests to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise, except that this product shall be of standard quality, and except to the extent otherwise stated Chomerics’ invoice, quotation, or order acknowledgement. We disclaim any and liability incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing or future patents covering any product or material or its use.