Fabric or knitted Wire Mesh Over Foam and Conductive Foam

Parker Chomerics product line family of SOFT-SHIELD® EMI gaskets provides a selection of strip and sheet stock commercial EMI gasket solutions suitable for most all indoor EMI shielding and grounding applications. These products rely on the unique construction of a conductivity- plated fabric or wire mesh, wrapped or knitted over a low closure force urethane foam. Other products in the family rely on a conductive foam technology.

1000 SOFT-SHIELD 1000 commercial EMI gaskets consist of monel or Ferrex® (tin-plated, copper-clad, steel wire) knitted over a soft urethane foam core.  The profiles offered provide a gasketing solution with exceptionally low closure force requirements and excellent shielding.
   

SOFT-SHIELD 2000
commercial EMI gaskets consist of silver-plated nylon yarn knitted as the outer layer over a highly compressible thermoplastic, EPDM foam core. Of special note is the special treatment that adheres the yarn to the core which makes the gasket self-terminating.
   

 

The following are also listed as CABLE/CONNECTOR SHIELDING SOLUTIONS
to View More click here

3500 SOFT-SHIELD 3500 commercial EMI gasket product offering consists of multiple profiles of a conductive fabric wrapped around open cell urethane foam. The over 250 product profiles consist of rectangular, D-shape, P-shape, stealth, C-fold, and knife-edge. These profiles offer an EMI gasket which can perform with less than a 1 lb. per inch force.
   
3700 SOFT-SHIELD 3700 allows the use of fabric over foam EMI grounding and gasketing technology to be used in elevated temperature applications where continuous operating temperatures of 125o C or less are required. The conductive fabric over high temperature foam also provides excellent EMI shielding and superior compression set properties.
   
4000 SOFT-SHIELD 4000 EMI gaskets consist of a closed cell urethane core, machine wrapped with a fabric-reinforced aluminum foil. The available rectangular product forms provide solutions for access panel, backplane, or I/O panel shielding.
   
4000 SOFT-SHIELD 4800 EMI gaskets 4800 Multi-planar conductive Z axis foam EMI gaskets represent Parker Chomerics newest innovation in soft foam based EMI shielding technology. The unique integration of electrically conductive silver-plated fibers into low density open cell urethane foam provides the basis for a performance driven, cost effective EMI shielding solution.
   
4800 SOFT-SHIELD 4850 represents the latest advancement in EMI shielding gaskets based on multi-planar, Z-axis conductive foam technology. SOFT-SHIELD 4850 is based on the unique integration of electrically conductive silver-plated fibers into a low density urethane foam. Specific applications include I/O connector panels and printed circuit board rack, backplane EMI gasketing. 
4800 SOFT-SHIELD 4850 STRIP gaskets provide the unique, conductive Z-axis foam technology in more functional rectangular strip configurations.
5000 SOFT-SHIELD 5000 Series gaskets offer a low cost and high performance EMI gasketing solution for commercial electronic systems. The high reliability, conductive fabric over foam core construction provides a cost effective alternative to beryllium copper or stainless steel fingerstock EMI gaskets. Available profiles include: D-shape, P-shape, C-fold, astragel, triangular, knife-edge, rectangular, and square.

NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential use are beyond our control, all recommendations or suggestions are presented without guarantee or responsibility on our part and users should make their own tests to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise, except that this product shall be of standard quality, and except to the extent otherwise stated Chomerics’ invoice, quotation, or order acknowledgement. We disclaim any and liability incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing or future patents covering any product or material or its use.