Conductive Adhesives, Gap Fillers, Greases & Sealants
The Chomerics family of CHO-BOND electrically conductive adhesives, sealants/gap fillers, caulks, and greases provide a variety of solutions for solving EMI problems beyond that which can be addressed simply with EMI gasketing. Resin systems include: silicone, epoxy, acrylic, polyurethane, polyolefin, and polyisobutlylene. Conductive fillers include: silver, silver-plated copper, silver-plated aluminum, silver-plated glass, copper, and nickel. Conductive adhesives are used for conductive elastomer EMI gasket attachment whereas conductive sealants/gap fillers and caulks are used for addressing open seams in electronic enclosures. Conductive greases addresses EMI shielding issues such as metallic shafts protruding through metal bulkheads.
NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential use are beyond our control, all recommendations or suggestions are presented without guarantee or responsibility on our part and users should make their own tests to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise, except that this product shall be of standard quality, and except to the extent otherwise stated Chomerics’ invoice, quotation, or order acknowledgement. We disclaim any and liability incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing or future patents covering any product or material or its use.