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CHO-BONDŽ
Adhesives
CHO-BONDŽ
adhesives are electrically conductive epoxy and silicone resins
that cure at room temperature, elevated temperature or in
humidity. CHO-BOND epoxies are two-part, silver-filled or
silver-plated-copper-filled adhesives which cure at room or
elevated temperatures into rigid structural bonds for attaching
EMI vents, windows, mesh gaskets, or for filling cracks and
seams. CHO-BOND conductive silicones contain silver-plated-copper.
Their flexible nature in cured form is ideal for bonding conductive
silicone gaskets in place.
Download
SYRINGE-PAK Data Sheet (.pdf)
Download
Data Sheet (.pdf)
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