THERMFLOW®
T777 Low Thermal Resistance Phase-Change Pad
Polymer Solder Hybrid (PSH) Thermal Interface Material
T777 high-performance
Polymer Solder Hybrid (PSH) material is the latest addition to Chomerics’
THERMFLOW® family of Phase Change Materials (PCM). T777 has
superior thermal properties, enhanced thermal stability and excellent
long-term reliability. T777 was developed to meet the TIM1.5 requirements
for next generation Intel microprocessors for mobile applications.
T777 PSH material incorporate low-melt alloy fillers as well as
polymer systems to maximize thermal conductivity and thermo-oxidative
stability. Typical applications are thermal interface pads for microprocessors,
graphics processors, chipsets, ASICs and power modules where thermal
grease or metallic solder is also used.
NOTE: T777’s
use is restricted to (1) only those computer systems that have an
Intel microprocessor, and (2) outside of the computing industry.
Chomerics customers are required to accept the attached End User
License Agreement (EULA) when buying the product.
Download
Data Sheet (.pdf)
Application Note (.pdf)
RoHS
Compliance Report (.pdf)
T777
Reliability Test Report (.pdf)
Safety
Article Statement (.pdf)
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Typical
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