THERMFLOW®
PC07DM-7
THERMFLOW® PC07DM-7 phase-change Thermal Interface Materials (TIM) are designed to minimize the thermal resistance between power dissipating electronic components and heat sinks. This low thermal resistance path maximizes heat sink performance and improves component reliability. At room temperature, THERMFLOW materials are solid and easy to handle. This allows them to be consistently and cleanly applied as dry pads to a heat sink or component surface.
THERMFLOW material softens as it reaches component operating temperatures. With light clamping pressure it will readily conform to both mating surfaces. This ability to completely fill interfacial air gaps and voids typical of component packages and heat sinks allows THERMFLOW pads to achieve performance superior to any other thermal interface materials.
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