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CHOFORMŽ
Automated Form-in-Place Gasket Technology
Chomerics'
automated CHOFORMŽ technology dispenses form-in-place conductive
elastomer gaskets on metal or plastic housings. The system
applies programmed gasket beads with exceptional accuracy
in three full axes, compensating for uneven surfaces in castings
and molded parts to provide consistent, highly reliable seals.
Gaskets can be applied on flanges as narrow as .030 inch (0.76
mm), affording more space for board components or allowing
smaller overall packaging. Cho-Form gaskets cure in minutes
and provide more than 75 dB attenuation from 200 MHz to 10
GHz.
Form-In-Place- Product Selector Guide (.pdf)
Corrosion
Resistant Form-in-Place EMI Shielding Material
CHOFORM
5541 Corrosion Resistant Matl for Castings (.pdf)
CHOFORM
5550 Corrosion Resistant Data Sheet (.pdf)
CHOFORM
5550 and 5541 Corrosion Testing - Test Report (.pdf)
CHOFORM
5550 and 5541 Electrical Properties - Test Report (.pdf)
CHOFORM
5550 and 5541 Compression/Deflection - Test Report (.pdf)
CHOFORM
5541 Reliability Test Report (.pdf)
View Case Study
Request
a Sample
ParPHorm
S1936, S1945, L1938 (non-conductive) Form-in-Place Sealing
Compounds
ParPHorm is a family of non-conductive, thermal cure, form-in-place,
elastomeric sealing compounds. These silicone and fluorosilicone
materials provide environmental, fluid, and dust sealing of
small enclosures. The product line consists of state-of-the
art compounds designed to be robotically dispensed onto small
housings and then thermally cured. Curing of the dispensed
materials is done via in-line ovens at 230 o F for 40 minutes.
Dispensed bead heights range from 0.018 in. (0.46 mm) to 0.13
in. (3.94 mm). Application advantages of the materials are
resistance to a wide variety of fluids, excellent substrate
adhesion, low hardness, and outstanding compression set properties.
Download
ParPHorm Data Sheet (.pdf)
Download
ParPHorm 1800 Data Sheet (.pdf)
Download
ParPHorm S1945 MSDS (.pdf)
Typical
Applications
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