|
Chomerics Div. of Parker Hannifin Corporation Launches Thermal
Interface Material for Next Generation Microprocessors
WOBURN, MA,
September 12, 2007 - Chomerics division of Parker Hannifin Corporation
has introduced T777, a new Polymer Solder Hybrid (PSH) Thermal Interface
Material with superior thermal properties, enhanced thermal stability
and excellent long-term reliability. T777 was developed collaboratively
for next generation Intel microprocessors for mobile applications.
It was optimized for Intel's Santa Rosa platform, Merom CPU and
verified with Yonah test vehicle.
T777 pads are
easy to handle during assembly and are readily re-workable. Unlike
traditional phase change materials, PSH materials incorporate low-melt
metal alloy fillers and polymer systems that maximize thermal conductivity,
thermo-oxidative stability and surface wetting during flow. On reaching
the required burn-in temperature above 64°C, the T777 pad flows,
attains minimum bond-line thickness less than 0.001 inch (0.025
mm) and achieves minimum thermal impedance of 0.03 °C-cm2/W.
The microprocessor can then run at lower design temperatures with
superior thermal performance. Long-term aging tests have shown that
T777 does not have dry-out issues common to thermal grease materials
and demonstrates relatively small change in End-of-Life thermal
performance after 5 years at 70°C.
According to
thermal business unit manager Gary Wood, "Although T777 was
developed for Intel's mobility architecture, it can also be used
for microprocessors in desktop, server, and telecom applications
requiring high performance and long-term reliability. In systems
with an Intel microprocessor, T777 can also be used with other high
performance devices such as graphics processors and chipsets."
For further
information call Chomerics at tel 781-935-4850, or visit the website
at www.chomerics.com
ABOUT CHOMERICS
Chomerics (Woburn, MA) is a global leader in development and application
of electrically and thermally conductive materials in electronics
systems. Chomerics is the first choice in EMI shielding and thermal
management solutions for communications, computer, consumer, automotive,
military, aerospace, and medical electronics markets. For details,
visitwww.chomerics.com
Note: CHOMERICS is a registered trademark of Parker
Hannifin Corporation.
ABOUT PARKER
HANNIFIN CORPORATION (NYSE:PH)
With annual sales exceeding $10 billion, Parker Hannifin is the
world's leading diversified manufacturer of motion and control technologies
and systems, providing precision-engineered solutions for a wide
variety of commercial, mobile, industrial and aerospace markets.
The company employs more than 57,000 people in 43 countries around
the world. Parker has increased its annual dividends paid to shareholders
for 51 consecutive years, among the top five longest-running dividend-increase
records in the S&P 500 index. For more information, visit the
company's web site at http://www.parker.com, or its investor information
site at http://www.phstock.com.
• back
|
|
