Chomerics Div. of Parker Hannifin Corporation Launches Thermal Interface Material for Next Generation Microprocessors

WOBURN, MA, September 12, 2007 - Chomerics division of Parker Hannifin Corporation has introduced T777, a new Polymer Solder Hybrid (PSH) Thermal Interface Material with superior thermal properties, enhanced thermal stability and excellent long-term reliability. T777 was developed collaboratively for next generation Intel microprocessors for mobile applications. It was optimized for Intel's Santa Rosa platform, Merom CPU and verified with Yonah test vehicle.

T777 pads are easy to handle during assembly and are readily re-workable. Unlike traditional phase change materials, PSH materials incorporate low-melt metal alloy fillers and polymer systems that maximize thermal conductivity, thermo-oxidative stability and surface wetting during flow. On reaching the required burn-in temperature above 64°C, the T777 pad flows, attains minimum bond-line thickness less than 0.001 inch (0.025 mm) and achieves minimum thermal impedance of 0.03 °C-cm2/W. The microprocessor can then run at lower design temperatures with superior thermal performance. Long-term aging tests have shown that T777 does not have dry-out issues common to thermal grease materials and demonstrates relatively small change in End-of-Life thermal performance after 5 years at 70°C.

According to thermal business unit manager Gary Wood, "Although T777 was developed for Intel's mobility architecture, it can also be used for microprocessors in desktop, server, and telecom applications requiring high performance and long-term reliability. In systems with an Intel microprocessor, T777 can also be used with other high performance devices such as graphics processors and chipsets."

For further information call Chomerics at tel 781-935-4850, or visit the website at www.chomerics.com

ABOUT CHOMERICS
Chomerics (Woburn, MA) is a global leader in development and application of electrically and thermally conductive materials in electronics systems. Chomerics is the first choice in EMI shielding and thermal management solutions for communications, computer, consumer, automotive, military, aerospace, and medical electronics markets. For details, visitwww.chomerics.com

Note: CHOMERICS is a registered trademark of Parker Hannifin Corporation.

ABOUT PARKER HANNIFIN CORPORATION (NYSE:PH)
With annual sales exceeding $10 billion, Parker Hannifin is the world's leading diversified manufacturer of motion and control technologies and systems, providing precision-engineered solutions for a wide variety of commercial, mobile, industrial and aerospace markets. The company employs more than 57,000 people in 43 countries around the world. Parker has increased its annual dividends paid to shareholders for 51 consecutive years, among the top five longest-running dividend-increase records in the S&P 500 index. For more information, visit the company's web site at http://www.parker.com, or its investor information site at http://www.phstock.com.