Low Thermal Resistance Phase Change Pads

MULTIPHASE™ T557/558 Phase Change Thermal Interface materials are specially formulated for use in high performance devices requiring minimum thermal resistance for maximum thermal performance and component reliability. T557 provides the superior performance of phase change materials with the added benefit of improved thermal stability over conventional phase change pads. T557 is a 0.005 inch (0.13mm) thick, inherently tacky adhesive film that softens and flows at device operating temperatures. T558 incorporates a thin foil carrier for a clean-break side. Unlike traditional phase change materials, T557/558 incorporate low melt temperature, alloy fillers that melt and flow above 65oC further reducing thermal resistance.

FEATURES & BENEFITS
- Increased performance at elevated temperatures
- Easy to handle and apply
- Comes in free film or foil backed version for reworkability
- Can be die-cut and tabbed for ease of installation
- No pump-out associated with thermal grease

For more information on MULTIPHASE T557 &T558 and to order samples, please visit:
http://www.chomerics.com/products/thermflow_557_558.htm