January 31, 2006, Woburn, Massachusetts

WOBURN, MA, January 31, 2007 – Chomerics, a division of Parker Hannifin Corporation (NYSE: PH), announced the introduction of THERM-A-GAP™ 569 and 579 ultra-soft thermal gap filler materials. 569 and 579 have the same high thermal performance as the 570 and 580 line of gap filler materials, but with increased conformability.

According to Product Manager Jonathan Bergin, “These products were developed to meet increasing customer demand for extreme conformability. THERM-A-GAP™ 569 is extremely soft, conformable, and cost-effective. 579 offers excellent conformability and thermal performance at competitive prices. In addition to pre-formed thicknesses from 0.020 to 0.2 inches, Chomerics offers custom thicknesses and molded solutions to meet our customers’ needs for design flexibility."

In the 3 W/m-K thermal conductivity range, 579 is the softest material available in the market. Both materials pass NASA outgassing (UL E595), rated UL-V0 for flammability, and are RoHs compliant. All four products are available on aluminum foil (A) or on “clean break" glass (G) fiber carrier. As with all previous Chomerics gap-fillers, the “A" versions have a high strength acrylic pressure sensitive adhesive for permanent attachment to cold surfaces. Typical applications include desktop and laptop computers, servers, telecommunications equipment, cellular handsets, consumer and automotive electronics, memory modules and vibration dampening in motors and engine controllers.