Chomerics T660 is an innovative approach to enhancing the performance of thermal grease. This thermal phase-change grease has been developed to meet the need for high power applications requiring a material with minimum bond line thickness and high conductivity. T660 is a non-curing, dispensable, highly conformable material which requires no cure cycle or mixing and dispenses to fill highly variable package tolerances. T660 grease contains small, performance enhancing conductive particles that melt at 62ºC, resulting in a minimal bond line and high thermal conduction. The material is thermally stable and requires virtually no compressive force to deform under assembly pressure. Simply dispense the grease onto your component, assemble the heat sink or chassis over the material, and ship your product. The combination of minimal pressure and the melting of these particles create the proper environment for the grease to obtain a thin interface and the highest thermal conduction.

Chomerics T650 is a thermal grease created to efficiently conduct heat and fill the voids between hot components and heat sinks. T650 is a non-curing, dispensable, highly conformable material which requires no cure cycle or mixing and dispenses to fill highly variable tolerances in electronics assemblies. The material is thermally stable. It requires virtually no compressive force to deform under assembly pressure leaving solder joints and leads stress free. Simply dispense the grease onto your component, assemble the heat sink or chassis over the material, and ship your product. This material is ideal for rework and field repair situations. T650 requires no refrigeration, stores at room temperature and has no filler settling issues. The material is a one component compound, is easy to dispense, and has an indefinite shelf life.

For more information on T660 and T650 thermal grease and to order samples, please visit:
http://www.chomerics.com/products/Thermal_Grease_650_660.htm