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 The increasing demand for high speed and great power electronic material engineered into compact and light packages is bringing intensified needs for thermal management to the industries where electronic is involved.
Thermal management material purpose is to provide the best thermal path from the package surface to the initial heat dissipater and on to the ambient environment.
Acofab offers a large range of standard and customised solution to meet any requirement where thermal management is an issue. |
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Thermflow
Phase-change thermal interface materials
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Cho-Therm
Thermally conductive insulator pads
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Heat spreaders provide a low-cost, effective means of cooling IC devices in restricted spaces where conventional heat sinks are not appropriate.
T-Wing heat spreaders use copper as a thermal conductor. They conform to non-flat surfaces for optimal thermal and mechanical performance.
C-Wing heat spreaders are ceramic, electrically non-conductive cooling solutions where localized sensitivity to EMI may be an issue.
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Thermally conductive silicone compounds
Flexible and low modulus systems, these compounds are ideal for heat transfer applications in electronic component cooling. They are available in two ranges: |
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Cho-Therm
Available as one-part or two-part compound.
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Therm-a-Form
Available in a range of kit sizes for both manual and pneumatic dispensing.
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Thermal greases are created to efficiently conduct heat and fill the voids between hot components and heat sinks.
They are available in two references:
T650: one component compound ideal for rework and field repair situations.
T660: specificaly developed to meet the need for high power applications requiring a material with minimum bond line thickness and high conductivity.
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