Chomerics is a leading global manufacturer of EMI (electromagnetic interference) shielding materials. Our strengths are service, experience, technology, and unparalleled design capabilities.
Since 1961, Chomerics has been the primary force in the development and application of conductive elastomer technology in extruded, molded and RTV compound forms and with form-in-place gasketing technology. Our EMI shielding materials include conductive elastomers; metal EMI gasketing; spring finger gaskets; EMI cable shielding; conductive coatings and adhesives; shielding laminates and foil tapes; and shielded vents and windows.
We also manufacture an innovative line of thermal interface materials. Chomerics products have been designed into thousands of applications and help guarantee the performance, integrity, survivability, and maintainability of communications equipment, radars, aircraft, missiles, spacecraft, computers, fire control systems and industrial electronics.
Our comprehensive EMI testing facilities provide us constant exposure to real-world problems. We meet shielding challenges head on, and respond with effective solutions.
Chomerics is a division of the Seal Group of the Parker Hannifin Corporation. Parker Seal is one of the world's largest and most experienced manufacturers of elastomer and other sealing and shielding devices.
NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential use are beyond our control, all recommendations or sug tions are presented without guarantee or responsibility on our part and users should make their own tests to determine the suitability of our products in any specific situation. This product is sold w out warranty either expressed or implied, of fitness for a particular purpose or otherwise, except that this product shall be of standard quality, and except to the extent otherwise stated Chomerics’ invoice, quotation, or order acknowledgement. We disclaim any and liability incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be construed as a rec mendation to use any process or to manufacture or to use any product in conflict with existing or future patents covering any product or material or its use.