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THERM-A-GAP™ Gel T630, 8010, GEL30 T630G, T635, & T636 - Fully Cured Thermally Conductive Form-in-Place
Gap Fillers
THERM-A-GAP™ Gel 8010, GEL30, T630, T630G,
T635, & T636 Gap Fillers - are Chomerics’ latest
development in thermally conductive gap fillers. These unique materials
are ideal for applications where typical gap filling pads cause
too much stress on component solder joints and leads, resulting
in damage to the printed circuit board. These gels are highly
conformable, one component pre-cured silicone that can be dispensed
to fill large and uneven gaps in electronics assemblies. The viscoelastic
paste is a form stable, fully cured silicone material that takes
little to no compressive force to deform during assembly. The "G"
versions contain 0.010” glass beads, used for a compression
stop for applications requiring electrical isolation. All products
have low extractable silicone levels and pass the Bellcore silicone
extractable specification for the telecom industry.
Download
GEL30 and 8010 Data Sheet (.pdf)
Download
T630. T630G, T635 and T636 Data Sheet (.pdf)
Download
T630/T630G Application Guide (.pdf)
Download
T635/T636 Application Guide (.pdf)
Request
a Sample
Typical Applications
Related
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